At a glance
| Booth | I3110 |
| Country | TW |
| Website | www.grintimate.com |
Company profile
Grintimate Precision Industry Co., Ltd. is a professional manufacturer of high-precision hydrostatic grinding machines using hydrostatic bearing technology that includes hydrostatic bearing spindles, hydrostatic rotary worktables, and hydrostatic guideway modules. Its full machine series is equipped with hydrostatic bearing systems and is described as providing high-precision, high-quality, low-wear, and environmentally friendly precision processing machines. The hydrostatic bearing system features high rigidity, vibration resistance, non-contact operation between metals, high loading capacity, and long service life. The company identifies applications across high-tech, electric-vehicle, aerospace, medical, and metal-processing industries. Materials listed for grinding include aluminum alloy, stainless steel, tungsten steel, ceramics, wafer, SiC, and optical glass. GRINTIMATE states that its hydrostatic systems not only improve grinding efficiency but also maintain stable and high-precision accuracy during grinding. The main product range includes the CTS-100 special-purpose hydrostatic cylindrical plunge grinding machine and CDC-series hydrostatic cylindrical plunge grinding machines. It also includes CAC-series hydrostatic cylindrical angular grinding machines, GRC-series horizontal hydrostatic rotary surface grinders, and GTR-series hydrostatic wafer grinders dedicated to semiconductor applications. The wafer-grinder line includes the Dual Spindles Wafer Grinder GTR-2315, adding a specifically named dual-spindle model to the semiconductor-oriented GTR range. Across these machines, Grintimate combines hydrostatic spindle, guideway, and rotary-worktable technologies with grinding platforms intended for precision processing of both industrial materials and semiconductor-related materials.
Exhibits
GRINTIMATE provides localized repair and customization services for hydrostatic spindles in imported equipment, using its hydrostatic-technology experience to support existing machines. The stated objectives of this service are to extend equipment lifespan, improve machining stability, and reduce repair and replacement costs. Original-equipment compatibility is addressed through reverse engineering and redesign based on the original spindle specifications, structure, and interfaces of imported machines. Localized production of key components and processes is used to shorten repair time while maintaining consistent quality and performance. The local-support model also includes immediate technical consultation, on-site diagnostics, and after-sales service intended to help customers recover productivity more quickly. For hydrostatic spindles, a high-pressure oil film provides ultra-high stiffness and load capacity for heavy cutting with stable support. Non-contact operation is used to achieve near-zero wear and extended service life, while extremely low vibration and high rotational accuracy suppress chatter and improve surface finish and accuracy. Hydrostatic spindle thermal stability is supported by oil-film heat dissipation that minimizes thermal deformation, and the spindle is described as suitable for long-term continuous operation with stable performance over extended machining cycles. For hydrostatic guideways, low friction and the absence of stick-slip support high-precision positioning over full travel and smooth micro-feeding. High damping helps absorb vibration and improve contour accuracy, while high load capacity with minimal deformation supports large and heavy worktables. The guideway is also described as having minimal wear for long-term accuracy retention together with smooth motion and repeatability suited to precision and automated machining. For hydrostatic worktables, high rotational accuracy and rigidity support precision indexing and continuous rotary machining. Backlash-free smooth motion provides consistent angular positioning, and high load capacity allows precision to be maintained with large or heavy workpieces. Low friction and low heat generation are used to improve machining stability and reduce thermal error, and the worktable is intended for precision surface and circular machining in semiconductor and precision industries. The product categories listed with these hydrostatic capabilities include Multi-Spindles Wafer Grinder, Single Spindle Wafer Grinder, Rotary Surface Grinder, and Cylindrical Grinder. The broader technical-service offering also lists Customized Hydrostatic Solutions, Grinding Service, Maintenance Service, and One-Stop Services alongside the localized spindle repair and redesign work. Together with the GTR semiconductor wafer-grinder series and GTR-2315 dual-spindle model, these repair, customization, hydrostatic-component, and grinding capabilities address wafer, SiC, optical-glass, and other precision-material processing requirements.
Capabilities and products
- high-precision hydrostatic grinding machine manufacturing
- hydrostatic cylindrical plunge grinding machines
- hydrostatic cylindrical angular grinding machines
- horizontal hydrostatic rotary surface grinders
- hydrostatic wafer grinders for semiconductors
- hydrostatic spindle repair and customization