Achilles Advanced Technology Co., Ltd.

Exhibitor at SEMICON Taiwan 2026 · Booth K2587

Booth K2587Country TW3 product topics
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BoothK2587
CountryTW
Websitewww.achilles-at.com.tw
Exhibitor profile

Company profile

Achilles Advanced Technology Co., Ltd. belongs to a plastics business whose history dates to its founding in 1947 and whose core capability is proprietary plastic-processing technology. The business applies that plastic-processing foundation across products used in daily life as well as health and nursing-care fields. Its broader material experience includes high-performance films and synthetic leather. It also produces insulation and heat-shield industrial materials for construction and engineering fields. Electronics-related industrial materials are another part of the stated product range, linking its plastics expertise with technology-industry applications. Achilles describes its manufacturing approach as making products through its own plastic-processing technology while considering future-oriented and global needs. For semiconductor-related applications, Achilles Advanced Technology Co., Ltd. identifies wafer cases as part of its product scope. The semiconductor-facing range is organized around wafer transport packaging, antistatic products and film-base materials. The company-site information identifies a Japan headquarters under Achilles Corporation and a Taiwan operation under Achilles Advanced Technology Co., Ltd.

Exhibitor profile

Exhibits

Achilles Advanced Technology Co., Ltd. presents a wafer-packaging system designed to protect wafers against shock and static electricity. The semiconductor packaging lineup is divided into WAFER SHIPPER, INTERLEAF and CUSHION product groups. Within the WAFER SHIPPER category, PROTOS CARRIER is the named wafer-protection case family. The PROTOS CARRIER range includes a rotary wafer box for HWS applications. It also includes the MA Series latch-type wafer box for HWS applications. For FFS applications, the carrier range includes the NA Series rotary frame-film wafer box. The FFS range also includes the ND Series latch-type frame-film wafer box. NDM Series is additionally listed in the PROTOS CARRIER wafer-protection case lineup. PROTOS SPACER is the wafer-protection interleaf family within the INTERLEAF portion of the packaging system. The spacer lineup includes PEA antistatic interleaf material for wafer separation and protection. CPS conductive interleaf material is also listed as part of the PROTOS SPACER range. PROTOS RING SPACER is a wafer-protection pad product and is identified as a ring-shaped spacer. PROTOS CUSHION is the wafer-protection cushioning-sponge-sheet family within the CUSHION category. The cushion products include PEAS antistatic sponge sheets. They also include PESD conductive sponge sheets. Taken together, the named wafer-shipping products combine rigid protective carriers, interleaf materials, ring spacers and cushioning sheets around the stated goals of shock and static-electricity protection. The product organization therefore covers both wafer cases and the separation or cushioning materials placed around wafers during transport packaging. The semiconductor-related offering shown by the company is centered on wafer transportation and protection rather than on wafer-processing equipment itself.

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